TDK offers a wide range of load port systems developed for 200 mm and 300 mm wafer, tape frame and panel-level processes. Each platform is engineered for precision, reliability and cleanroom-grade operation, ensuring seamless integration with EFEMs, cluster tools and backend equipment.

TAS300J1 FOUP Load Port – 300 mm Wafer Handling
• Fully SEMI-compliant
• Pneumatic control system, motor-free design for low maintenance
• Smooth, particle-free motion and high alignment accuracy
• ISO Class 1 cleanroom compatibility
• Optional modules: mapping (200 / 300 mm, glass, quarter panel), carrier ID, E84, N2 purge, Infopad
• Proven reliability with more than 200,000 units shipped worldwide

TAS200 Series SMIF Load Port – 200 mm Wafer Handling
• Supports SEMI standards for 200 mm SMIF pods
• Pneumatic open/close and door interlock mechanism
• Compatible with both front- and top-opening SMIF pods
• Optional mapping and carrier ID integration
• Compact, contamination-controlled construction

Tape Frame Load Port
• Optimised for tape frame carrier handling in advanced packaging
• Supports frame size up to 8 inch
• Optional chuck-based alignment and optical mapping sensor
• Designed for frame transfer robots and UV-curing modules
• Cleanroom-ready design with low particle generation

Panel / PLP Load Port
• Developed for backend and panel-level packaging applications (PLP / FOPLP / PCB substrate handling)
• Supports panel sizes up to 650 × 650 mm
• Integrated Panel Mapping Technology for precise position and presence detection
• Compatible with AGV / AMR transport systems via E84 interface
• Available with N2 purge and vacuum docking options

Precise, clean and modular load port solutions for every process node.