Peeler
Discover the world's leading technology for automatically removing Mylar films with Advanced Engineering! Our revolutionary peeler has established itself as a global success and offers a complete and efficient PCB peeling process thanks to its innovative peeling method and integrated buffer and centring device. Compact and extremely durable, the PM01-CPB guarantees maximum productivity and flexibility for your production.
The same applies to the PAC650 model for peeling special substrates.
Foil Peeling Systems
Thanks to its revolutionary peeling method, Advanced Engineering's PM01-CPB is the most successful automatic mylar foil peeler in the world. It is equipped with both a buffer and a centering device, enabling a complete PCB peeling process. The PM01-CPB is compact and extremely durable, ensuring both high productivity and tremendous flexibility.
Advanced Engineering's SAP650-R Stand Alone Peeler w/Robot is a modified version of the SAP650 and is equipped with an additional L61 robot arm. This enables precise loading and unloading directly into and/or out of a rack. The SAP650-R also combines a center, peeler and buffer in one, making it the ideal solution for comprehensive mylar peeling. Based on 25 years of experience, the new SAP 650-R film peeler impresses with its revolutionary concept. It is available as a compact inline solution or optionally with an integrated robot stacker.
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